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Bonding Wire는 반도체 칩과 이를 받쳐주는 리드 프레임의 사이를 연결하는 가느다란 도선입니다.

Overview

"Bonding Wire, adopting Absolutely Purified Gold Meterial"

woolimworld is a professional company in percious metal industry. and has produced and provided GOLD BONDING WIRE with various uses and dimesions based on the processing technology accumulated for 30 years with using highly purified Au material over than 5N(99.999%)

Gold Bonding Wire : Features and Merits

  • 01Uniform and stable FAB (Free Air Ball) and excellent Loop feature
  • 02Customer satisfaction through strict feature (E/L, E/L) control
  • 03Clean production line and strict quality control system
  • 04Precious metal processing know-how accumulated over than 30 years
  • 05Rapid technical support through prominent analysis system

Types - Bonding Wire

Bonding Wire

Bonding Wire 개요

Bonding Wire is a thin line to connect semiconductor chip and outer lead electrically, and a functional material composing the semiconductor. WooLimWorld Gold Bonding Wire, manufactured with Au with high purity of 99.999%, has been used in Korean semiconductor industry with its prominent features and perfect quality, and also acknowledged its quality by world market. WooLimWorld also suggests customer breaking through for continuously raised gold price developing low cost products like Cu, Pd coated Cu and Au-Ag alloy wire.

Bonding Wire Type

Gold Bonding Wire
Gold & Silver alloy Wire
Copper Bonding Wire
Pd-coated Copper Wire

Dimension

Material Wire Type Wire Size Tengile
Strength
Elongation HAZ Loop
Height
Range
Wire
Length
Mil gf % um Mil Mil
Au HS-M
Normal
Loop
0.410Min. 1.51.0-5.0170-210Min. 5.0Max. 100
0.512Min. 2.01.0-5.0170-210Min. 5.0Max. 110
0.615Min. 3.01.0-6.0180-220Min. 5.5Max. 120
0.718Min. 3.52.0-7.0190-230Min. 5.5Max. 130
0.820Min. 4.02.0-7.0200-250Min. 6.0Max. 140
0.923Min. 6.02.0-7.0220-270Min. 7.0Max. 160
1.025Min. 8.02.0-8.0250-290Min. 8.0Max. 170
1.230Min. 11.03.0-8.0270-320Min. 9.0Max. 180
1.538Min. 18.03.0-12.0300-400Min. 12.0Max. 210
2.050Min. 30.04.0-12.0350-450Min. 15.0Max. 230
HS-L
Low
Loop
0.410Min. 1.51.0-5.080-110Min. 3.0Max. 80
0.512Min. 2.01.0-5.080-110Min. 3.0Max. 90
0.615Min. 3.51.0-6.090-120Min. 3.5Max. 100
0.718Min. 4.02.0-7.0100-130Min. 3.5Max. 110
0.820Min. 5.02.0-7.0120-150Min. 4.0Max. 120
0.923Min. 7.02.0-7.0130-160Min. 4.5Max. 140
1.025Min. 9.02.0-8.0140-160Min. 5.0Max. 150
1.230Min. 12.03.0-8.0160-180Min. 6.0Max. 160
1.538Min. 19.04.0-12.0190-230Min. 8.0Max. 190
2.050Min. 31.06.0-15.0220-280Min. 11.0Max. 210
HS-H
Long
Loop
0.410Min. 1.51.0-5.090-120Min. 4.0Max. 110
0.512Min. 2.01.0-5.090-120Min. 4.0Max. 120
0.615Min. 3.51.0-6.0100-130Min. 4.5Max. 130
0.718Min. 4.02.0-7.0110-140Min. 4.5Max. 140
0.820Min. 5.02.0-7.0130-150Min. 5.0Max. 160
0.923Min. 7.02.0-7.0140-160Min. 5.5Max. 180
1.025Min. 9.02.0-8.0170-190Min. 6.0Max. 200
1.230Min. 12.03.0-8.0180-200Min. 7.0Max. 240
1.538Min. 19.04.0-12.0200-240Min. 10.0Max. 280
2.050Min. 31.06.0-15.0220-290Min. 13.0Max. 320
HP
High
Performance
0.410Min. 2.01.0-5.070-90Min. 2.0Max. 130
0.512Min. 2.51.0-5.070-90Min. 2.0Max. 140
0.615Min. 3.51.0-6.080-100Min. 2.5Max. 150
0.718Min. 5.02.0-7.090-110Min. 2.5Max. 170
0.820Min. 6.02.0-7.0100-120Min. 3.0Max. 180
0.923Min. 8.02.0-7.0110-130Min. 3.5Max. 190
1.025Min. 10.02.0-8.0120-140Min. 4.0Max. 220
1.230Min. 13.03.0-8.0130-150Min. 5.0Max. 260
1.538Min. 21.04.0-12.0160-200Min. 7.5Max. 320
2.050Min. 35.06.0-15.0180-230Min. 9.0Max. 390
HS-S
Universal
0.410Min. 2.01.0-5.060-80Min. 2.0Max. 140
0.512Min. 2.51.0-5.060-80Min. 2.0Max. 150
0.615Min. 3.51.0-6.070-90Min. 2.5Max. 160
0.718Min. 5.02.0-7.080-100Min. 2.5Max. 180
0.820Min. 6.02.0-7.090-110Min. 3.0Max. 190
0.923Min. 8.02.0-7.0100-120Min. 3.5Max. 200
1.025Min. 10.02.0-8.0110-130Min. 4.0Max. 230
1.230Min. 13.03.0-8.0120-140Min. 5.0Max. 260
1.538Min. 21.04.0-12.0150-190Min. 7.5Max. 320
2.050Min. 35.06.0-15.0170-220Min. 9.0Max. 390
HS-J
Low-k
0.410Min. 2.01.0-5.060-80Min. 2.0Max. 140
0.512Min. 2.51.0-5.060-80Min. 2.0Max. 150
0.615Min. 3.51.0-6.070-90Min. 2.5Max. 160
0.718Min. 5.02.0-7.080-100Min. 2.5Max. 180
0.820Min. 6.02.0-7.090-110Min. 3.0Max. 190
0.923Min. 8.02.0-7.0100-120Min. 3.5Max. 200
1.025Min. 10.02.0-8.0110-130Min. 4.0Max. 230
1.230Min. 13.03.0-8.0120-140Min. 5.0Max. 260
1.538Min. 21.04.0-12.0150-190Min. 7.5Max. 320
2.050Min. 35.06.0-15.0170-220Min. 9.0Max. 390
HS-K
Advanced
2N
0.410Min. 2.01.0-5.050-70Min. 1.5Max. 150
0.512Min. 2.51.0-5.050-70Min. 1.5Max. 160
0.615Min. 3.51.0-6.055-75Min. 2.0Max. 170
0.718Min. 5.02.0-7.060-80Min. 2.5Max. 180
0.820Min. 6.02.0-7.070-90Min. 3.0Max. 190
0.923Min. 8.02.0-7.080-100Min. 3.5Max. 210
1.025Min. 10.02.0-8.090-110Min. 4.0Max. 230
1.230Min. 13.03.0-8.0110-140Min. 4.5Max. 270
1.538Min. 21.04.0-12.0130-180Min. 6.0Max. 330
2.050Min. 35.06.0-15.0150-190Min. 8.0Max. 390
HS-U
H.T.S
(Pd doped)
0.410Min. 2.01.0-5.045-65Min. 1.5Max. 160
0.512Min. 2.51.0-5.045-65Min. 1.5Max. 170
0.615Min. 3.51.0-6.050-70Min. 2.0Max. 180
0.718Min. 5.02.0-7.055-75Min. 2.0Max. 190
0.820Min. 6.02.0-7.060-80Min. 2.5Max. 200
0.923Min. 8.02.0-7.070-90Min. 3.0Max. 220
1.025Min. 10.02.0-8.080-100Min. 3.5Max. 240
1.230Min. 13.03.0-8.090-110Min. 4.0Max. 280
1.538Min. 21.04.0-12.0110-140Min. 5.5Max. 340
2.050Min. 35.06.0-15.0130-180Min. 7.0Max. 400
Au Ag HS-G 0.410Min. 1.52.0-6.040-60Min. 1.5Max. 180
0.512Min. 2.03.0-7.040-60Min. 1.5Max. 190
0.615Min. 3.04.0-8.045-65Min. 2.0Max. 200
0.718Min. 5.07.0-13.050-70Min. 2.0Max. 210
0.820Min. 6.58.0-13.055-75Min. 2.5Max. 220
0.923Min. 7.08.0-14.060-80Min. 3.0Max. 240
1.025Min. 8.58.0-14.070-90Min. 3.5Max. 260
1.230Min. 12.08.0-14.080-100Min. 4.0Max. 300
1.538Min. 18.09.0-15.0100-130Min. 5.5Max. 360
2.050Min. 30.010.0-17.0120-170Min. 7.0Max. 420
Cu HS-CL 0.615Min. 2.53.0-15.070-90Min. 1.5Max. 180
0.718Min. 3.03.0-15.080-100Min. 2.0Max. 180
0.820Min. 4.03.0-17.090-110Min. 2.0Max. 190
0.923Min. 5.04.0-18.0110-130Min. 2.5Max. 200
1.025Min. 6.06.0-20.0120-140Min. 3.0Max. 220
1.230Min. 7.08.0-22.0130-150Min. 3.5Max. 240
1.333Min. 8.08.0-22.0140-160Min. 4.0Max. 280
1.538Min. 12.09.0-23.0160-180Min. 5.5Max. 340
2.050Min. 20.010.0-24.0200-230Min. 7.0Max. 400
HS-CW 0.615Min. 2.53.0-15.065-85Min. 1.5Max. 190
0.718Min. 3.03.0-15.070-90Min. 2.0Max. 190
0.820Min. 4.03.0-17.080-100Min. 2.0Max. 200
0.923Min. 5.04.0-18.0100-120Min. 2.5Max. 210
1.025Min. 6.06.0-20.0110-130Min. 3.0Max. 230
1.230Min. 7.08.0-22.0120-140Min. 3.5Max. 250
1.333Min. 8.08.0-22.0130-150Min. 4.0Max. 290
1.538Min. 12.09.0-23.0150-170Min. 5.5Max. 350
2.050Min. 20.010.0-24.0190-220Min. 7.0Max. 410
Pd Cu HS-NP 0.615Min. 2.53.0-15.060-80Min. 1.5Max. 200
0.718Min. 3.03.0-15.065-85Min. 2.0Max. 200
0.820Min. 4.03.0-17.070-90Min. 2.0Max. 210
0.923Min. 5.04.0-18.090-110Min. 2.5Max. 220
1.025Min. 6.06.0-20.0100-120Min. 3.0Max. 240
1.230Min. 7.08.0-22.0110-130Min. 3.5Max. 260
1.333Min. 8.08.0-22.0120-140Min. 4.0Max. 300
1.538Min. 12.09.0-23.0140-160Min. 5.5Max. 360
2.050Min. 20.010.0-24.0180-210Min. 7.0Max. 420

Processing

Bonding Wire : Processing

Bonding Wire의 제품공정

Technical Data - Physical property

Select Physical property   

Wire Type Property : Physical property

Wire Type
Type Property
\Loop
Normal
(HS-M)
Low
(HS-L)
Long
(HS-H)
Ultra Low
(HS-C)
High Performance
(HP)
B/L(gr) ≥8 ≥9 ≥9 ≥10 ≥10
E/L(%) 2~6 3~8 3~8 3~8 3~8
HAZ Length (㎛) 250~290 150~170 170~190 120~140 70~100
Loop Height (㎛) Min.210 Min.120 Min.140 Min.100 Min.65
Loop Length (mil) Max.160 Max.150 Max.200 Max.230 Max.200
Application & Characteristics PDIP, SOIC, Discrete, Thin Package (TSOP,TQFP,
TSSOP,QFN,
CSP,μBGA)
Thick Package (PLCC, QFP, PBGA) Long wire length of HS-L LED Modified HP(ball neck damage)
Type Property
\Loop
Universal
(HS-S)
Low-k
(HS-J)
H.T.S
(HS-U)
Advanced wire
(HS-K)
 
B/L(Gr) ≥10 ≥10 ≥10 ≥10  
E/L(%) 3~8 3~8 2~8 3~8  
HAZ Length (㎛) 90~120 80 ~ 100 130 ~ 150 130~160  
Loop Height (㎛) Min.95 Min.90 Min.110 Min.100  
Loop Length (mil) Max.230 Max.240 Max.230 Max.210  
Application & Characteristics High Rel + Low Resistivity + Long wire(New wire) Modified HS-U (electrical effect) High Reliability (HTS) Low-k PKG(lower hardness)  

WIRE HARDNESS

Mechanical

TENSILE STRENGTH

Mechanical

FUSING CURRENT

Electrical

RESISTIVITY

Electrical

SPECIFIC ELECTRICAL RESISTIVITY

Electrical

RESISTIVITY

Electrical

Technical Data - LOW COST

Select Low Cost Product    

Copper Wire

MARKET DEMAND

  • Higher electrical performance without loss of RC delay even in high clock speed device
  • Lower cost material without loss in bond reliability

MERIT OF CU WIRE

Lower electrical resistance

  • Cu : 1.67μΩ cm Vs Au : 2.4μΩ cm

Lesser formation of harmful inter-metallic compound

DESIGN APPROACH

Lower FAB hardness & oxidation

  • Easy to form Cu oxide during manufacturing
  • Possibility of application to low-k device

Cu Wire

IMC GROWTH BEHAVIOR : Cu vs Au on Al Pad

IMC GROWTH BEHAVIOR

IMC growth rate of Cu vs Au Wire(Ref.)

IMC growth rate of Cu vs Au Wire(Ref.)

PROPERTY COMPARISON Cu vs Au Wire

Wire Type Cu Wire 4N Gold Wire Remark
Mechanical
Property
B/L 11~12gr 11~12gr Need wide elongation
control to cover
hardness of Cu
E/L 10~15% 4~6%
Hardness Ball 70 +/-3 Hv 60 +/-2 Hv
Wire 85 +/-5 Hv 70 +/-3 Hv
Electrical
Property
Resistivity 1.67 μΩ-cm 1.67 μΩ-cm Room Temp.
Length : 100mm
Fusing
Current
0.61 A 0.54 A Room Temp.
Length : 100mm
Density 8.93 gr/cm3 19.32 gr/cm3  
Melting Temperature 1084 C 1064 C  

Au-Ag Alloy Wire

MARKET DEMAND

Lower cost material without loss in bond performance

MERIT OF AU-AG ALLOY WIRE

Solution of demand of lower cost material

  • About 25% cost down effect compared to 4N Au wire

Almost same bonding performance compared to Au wire

  • Bondability , Loop control etc.

DESIGN APPROACH

Improvement in Reliability

  • IMC formation & growth Control in service life
  • Improvement of corrosion properties
Mechanism of IMC Formation

Evaporator Material

Evaporator Material : Overview

woolimworld is an technical leading group in the field of precious metal recycling and refining. We provide the highly purified Gold -Group Evaporator Material of 99.999%. Absolute Au is applied in bonding wire, Au group alloy, and sputtering target We also provides world customers with quality assured products based on various analysis equipments (EPMA, ICP-MASS, OES, EDX and etc) and 30-years accumulated know-how. WooLimWorld Metal Ltd. has come true the customer satisfaction with stable and excellent quality.

Evaporator Material : Types

증착재의 종류

Evaporator Material Specification

Product Type Chemical Composition (wt%) Shape
Au Ge Sh Be Sn Zn
HS-P Bal. - -   - - Pellet
HSGESB Bal. 12.0± 0.2 0.20± 0.02   - - Granule
HS-GE Bal. 12.0± 0.2         Granule
HS-BE Bal.     0.98± 0.02     Granule
HS-SB Bal.   0.50± 0.02   30.0± 0.5   Pellet
HS-SN Bal.           Granule
HS-ZN Bal. -   - - 5.0± 0.1 Wire

* Offers various products being customized

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TechnoPark 102402, SamJakRo 22, OJeongGu, BuCheonSi, KyungGiDo, 421740, KOREA
t +82 32 327 3322 / f +82 32 327 2600 / Director : bohyun.lee, bohyun.lee@woolimworld.com / e-mail : woojoo.jang@woolimworld.com
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