COMPANY / PRODUCTS / NOTICE / INQUIRY
BUSINESS
화학제품으로 귀금속 화합물, 도금재료, 불용성 전극 등을 생산합니다.

Overview

“A single Professional Manufacturer for Percious Mental Chemical Products in Korea"

We are a single prefessional company of chemical products related to precious mental in Korea, and maintain it quality and stability by manufacturing the advanced analyzer and equipments to percisely analyze up to the subtle amount using highly-purified materials over than 99.999% purity.

With mass production and stable keeping the stock, we delicer products within the promesed date, as well as procides differentiated services from complets A/S to the analysis by our know-how and up-to-data technology for percious metal analysis requiring high perciesness.

Types - Precious Metal Chemical

Precious Metal Compounds : Overview

귀금속화합물의 개요

Precious Metal is chemically stable and has excellent electric conductivity, and it has been widely delivered to semiconductor (Wafer, Lead Frame, COB and accessories with good evaluation for the quality of our products of PGC, PTC, and PSC. In addition, palladium compound has been used in petrochemistry and auto catalyst as well as plating.

Precious Metal Chemicals : Types

  • Au (Gold) compound
  • Pt (Platinum) compound
  • Pd (palladium) compound
  • Ag (Silver) compound
  • Rh (Rhodium) compound
  • Ru (Ruthenium) compound
  • Ir (Iridium) compound

Types - Plating Process

Plating Process : Overview

도금프로세스의 개요

We provide all plating processes for customer-specified precious metal from semiconductor components to ornaments. Various plating processes are prepared by each application which for getting precipitate with various purity, hardness, gloss, and tone.

Plating Process : Types

  • plating process
  • Pre/Post treatment
  • Activated carbon for plating, remover
  • Antidiscoloration

Types - Insoluble Cell

Insoluble Cell : Overview

불용성 전극의 개요

This is a solution-electrolytic insoluble metal cell coated with precious metal catalyst to corrosion resistant titanium. Particularly, it is featured to have stable dimension and durability by attaching Precious Metal catalyst evenly to be used in all fields of electrolytes.

Insoluble Cell : Types

  • PT/TI ANODE

Dimension - Precious Metal Chemicals

Select right box to see the detailed dimension for its type     

Au (Gold) compound

Au 금화합물
  • - Potassium cyanoaurate [KAu(CN)2]
  • - Potassium Tetracyanoaurate(I) [KAu(CN)4]
  • - Sodium Gold Sulfite [Na3Au(SO3)2]
  • - Ammonium Dicyanoaurate(I) [NH4Au(CN)2]
  • - Hydrogen Tetrachloroaurate [HAuCl4NH2O]
  • - Potassium Tetrachloroaurate [KAuCl4]
Product Name Molecular Formula Contents Purity Morphology Application
Potassium
Dicyanoaurate(I)
KAu(CN)2 68%
Up
99.9%
Up
Crystal Powder crystalline phase Most widely used in Au electroplating
Potassium
Tetracyanoaurate(I)
KAu(CN)4 57%
Up
99.9%
Up
Crystal Powder crystalline phase Mainly used in strong acid plating
Sodium Gold Sulfite
Na3Au(SO3)2 50g/ℓ - Transparents
Liquid phase
Used in Au Strike at SUS
Increasing the corrosion resistance and adhesive
Ammonium
Dicyanoaurate(I)
NH4Au(CN)2 5~10% - Liquid phase Au Electroplating
Hydrogen
Tetrachloroaurate
HAuCl4NH2O - - Transparents
Liquid phase
Electroplating
Potassium
Tetrachloroaurate
KAuCl4 52%
Up
99.9%
Up
Crystal Powder
crystalline phase
Electroplating

Pt (Platinum) compound

Pt 백금 화합물
  • - Hexachloroplatinate(Ⅳ) [H2PtCl6·6H2O]
  • - Potassium Tetrachloroplatinate(Ⅱ) [K2PtCl4]
  • - Diamminedinitro platinum [Pt(NH3)2(NO2)2]
  • - Hexaammineplatinum Chloride [Pt(NH3)6Cl4]
  • - Hydrogen Hexahydroxoplatinate [pPt(OH)6]
Product Name Molecular Formula Contents Purity Morphology Application
Hexachloroplatinate(Ⅳ)
H2PtCl6·6H2O 37%
Up
99.9%
Up
Reddish-yellow crystalline Catalyst manufacturing(petrochemistry, car waste gas deodorization),platinum plating, glass coloring agent
Potassium
Tetrachloroplatinate(Ⅱ)
K2PtCl4 46%
Up
99.0%
Up
Red crystalline Pharmaceutics (antitumor agent), platinum plating
Diamminedinitro
platinum(Ⅱ)
Pt(NH3)2(NO2)2 60%
Up
99.0%
Up
Light yellow powder Catalyst manufacturing, platinum plating
Hexaammineplatinum(Ⅳ)
Chloride
Pt(NH3)6Cl4 10~15g/ℓ - Yellow solution Catalyst manufacturing, platinum plating
Tetraammineplatinum(Ⅱ)
Chloride
H2Pt(OH)6 10~15g/ℓ - Yellow solution Catalyst manufacturing, platinum plating
Hydrogen
Hexahydroxoplatinate(Ⅳ)
H2Pt(OH)6 65%
Up
99.0%
Up
Yellow solution Catalyst manufacturing, platinum plating

Pd (palladium) chemicals

Pd 파라듐 화합물
  • - Palladium Chloride [PdCl2]
  • - Tetraammine dichloro palladium [Pd(NH3)4Cl2]
  • - Diammine dinitro palladium [Pd(NO3)2]
  • - Diammine dinitro palladium [Pd(NH3)2(NO2)2]
  • - Palladium Chloride HCI Solu [pPdCl6]
  • - Pallalyst 8,9,10
Product Name Molecular Formula Contents Purity Morphology Application
Palladium Chloride
PdCl2 59%
Up
99.0%
Up
reddish brownpowder Catalyst manufacturing (petrochemistry, car waste gas deodorization) Pd plating, glass coloring agent
Tetraammine dichloro
palladium(II)
Pd(NH3)4Cl2 43%
Up
99.0%
Up
Yellow crystalline Widely used in Pd plating
Palladium Nitrate
Pd(NO3)2 50%
Up
98.0%
Up
dark brown solution Catalyst manufacturing (petrochemistry, car waste gas deodorization)
Diammine dinitro
palladium(Ⅱ)
Pd(NH3)2(NO2)2 45%
Up
98.0%
Up
dark brown solution Catalyst manufacturing chemical, Pd plating
Palladium Chloride
HCI Solu.
H2PdCl6 100g/ℓ - dark brown solution Catalyst manufacturing, Pd plating
Pallalyst 8,9,10 - 3.4g/ℓ - reddish brown solution Used in plating catalyst for common Plastic plating

Ag (Silver) compound

Ag 은 화합물
  • - Potassium Dicyanoargentate [KAg(CN)2]
  • - Silver Nitrate [AgNO3]
  • - Silver Cyanide [AgCN]
  • - Silver Sulfate [Ag2SO4]
  • - Silver Chloride [AgCl]
  • - Silver Oxide [Ag2O]
Product Name Molecular Formula Contents Purity Morphology Application
Potassium
Dicyanoargentate
KAg(CN)2 54%
Up
99.0%
Up
white powder Widely used in Ag plating
Silver Nitrate
AgNO3 63%
Up
99.0%
Up
white crystalline Photographic industry, Silver Paste, mirror manufacturing, analytic agent
Silver Cyanide
AgCN 90%
Up
99.0%
Up
white powder Widely used in Ag plating, insoluble, and dissolved in the excess amount of KCN
Silver Sulfate
Ag2SO4 68%
Up
99.0%
Up
white crystalline glass coloring agent, COD measuring agent
Silver Chloride
AgCl 75%
Up
99.0%
Up
white powder Used in cell, resource
Silver Oxide
Ag2O 92%
Up
99.0%
Up
black powder Used in cell, paste material for electronic engineering

Rh (Rhodium) compound

Rh 로듐 화합물
  • - Rodium(Ⅲ) Sulfate [Rh2(SO4)3]
  • - Rhodium(Ⅲ) Chloride [RhCl3.4H20]
  • - Rhodium Nitrate [Rh(NO3)3]
  • - Rhodium Chloride HCISolu [H3RhCl6]
Product Name Molecular Formula Contents Purity Morphology Application
Rodium(Ⅲ) Sulfate
Rh2(SO4)3 100g/ℓ - Red solution Rh Electroplating
Rhodium(Ⅲ) Chloride
RhCl3.4H20 36%
Up
98.0%
Up
reddish brown crystalline Catalyst manufacturing용(petrochemistry, car waste gas, deodorization), glass coloring agent, Rh plating
Rhodium Nitrate
Rh(NO3)3 20g/ℓ - dark brown solution Catalyst manufacturing용(petrochemistry, car waste gas, deodorization), glass coloring agent, Rh plating
Rhodium Chloride
HCISolu
H3RhCl6 20g/ℓ - darkred solution Catalyst manufacturing용(petrochemistry, car waste gas, deodorization), glass coloring agent, Rh plating

Ru (Ruthenium) compound

Ru 루테늄 화합물
  • - Ruthenium(Ⅲ) Chloride hydrate [RuCl3xH2O]




Product Name Molecular Formula Contents Purity Morphology Application
Ruthenium(Ⅲ)
Chloride
hydrate
RuCl3xH2O 42%
Up
99.95%
Up
Crystal
Powder
Catalyst,
CVD material,
Fuell cell,
Dye-
sensitized
solar cell

Ir (Iridium) compound

Ir 이리듐 화합물
  • - Iridium(Ⅲ) Chloride hydrate [IrCl3xH2O]




Product Name Molecular Formula Contents Purity Morphology Application
Iridium(Ⅲ)
Chloride
hydrate
IrCl3xH2O 55%
Up
99.95%
Up
Crystal
Powder
OLED,
CVD material,
Catalyst

Dimension - Plating Process

Select right box to see the detailed dimension for its type     

Plating Process[EEJA WebSite]

Element Usage Plating Process Concen
tration
Preci
pitation efficiency
Current Density Application & Features
Gold Pure gold TEMPEREX 8400
TEMPEREX 209A
TEMPEREX 9500
MICROFAB AU 660
8
4
8
16
110~120 0.2~1.0
0.1~0.5
0.2~1.0
0.5~1.2
Semiconductor COB,TAP
wafer BUMP
Alloy AUTRONEX GVC(Au/Co)
AUTRONEX GVC-L(Au/Co)
AUTRONEX NI(Au/Ni)
8~18
4
8
20~30
10
30~40
10~150
0.5~10
0.3~1.5
CONNECTOR high speed electroplating
Electroless LECTROLESS Au
CERAGOLD 6070
- - - substitution/reducing
TYPE
STRIKE AUROBOND TN 1 - 1~8 Adhesive capacity elevation between material and gold plating
Silver   SILVERX II 80
24
3
63~67
67
67
1~5
1~2
1.5
gloss, pure silver plating solution, esp., connector, printer, wiring device
Palladium   PALLADEX LF4 3 28~33 0.25~1.0 Electronic components Semiconductor CONNECTOR
Rhodium   RHODEX
BRIGHT RHODIUM
SUPERRHODIUM
NO.1 SUPER WHITE
5
2
5
1
18
2~5
15
5
1.3
2.0
1.3
2.0
Industry, Ornament, esp., RHODEX is for lead switch
Platinum   PLATANEX 18 LS
PLATANEX SF
PLATINART 100
12
20
2
15~20
28~30
28~30
20
1~3
1~3
Plating solution
Ruthenium   RUTHENEX 10 10 1.0 high hardness, good corrosion resistance
Indium   INDEX 30 22 30 Non-gloss, highly-pure plating solution

Pre/Post Treatment

Process name Application Phase Characteristics
EETOPEX 11 Alkali degreaser powder Very high degreasing effect, metal washer with simple washing after treatment
EETOPEX 15 Acid washer powder Removing oxide, oil, and fingerprint
EETOPEX 195 antidiscoloration solution Antidiscoloration for copper / copper alloy lead frame
EETOPEX 6600SX SOLDER remover solution SPRAY or precipitation
EETOPEX W-AIS substitution protector solution Protection for substitutive precipitation of silver in useless part for IC lead frame silver plating

Activated carbon for plating

Process name Morphology Usage Application
Active carbon Particle phase 1~3gr/ℓ Special granular active carbon which removing organic pollutants.

Antidiscoloration

Process name Morphology Usage Application
GOLD STRIPPER
-CONCENTRATEN
Particle phase 10 folds dilution Gold remover, and usable in R.T. Fast removing without penetrating into underlayer.
HAKUREX CVH powder electrolyte Silver remover, and optimistic for copper lead frame.
HAKUREX ES solution precipitation Silver/copper remover, usable as a precipitator or spray. Underlayer and gloss. Removable without damaging silver plating.

Antidiscoloration

Process name Application Phase Characteristics
EVABRITE AU Organic solvent original stock Antidiscoloration for ornaments, protection of discoloration for gold / gold alloy.
EVABRITE TPS-AG Organic solvent 10 folds dilution of original stock Silver antidiscoloration, highly active deliquescent material. Widely used in from ornament to industry.
SILVER KEEPER solvent original stock New silver anti-discoloration without containing organic solvent

Dimension - Insoluble Cell

PT/TI ANODE

Types Application
PT/TI ANODE Used as ANODE in most plating processes

Processing

Chemical Products : Processing

화학제품의 제품공정

Tech.Data - Electrics Pure gold Plating Process

Temperex 209a,8400

Temperex 209a,8400
  • Au Purity 99.9% precipitates
  • Precipitate has excellent corrosion resistance, Bonding capacity, and soldering, which is optimum for the components of Pront circuit machine Semiconductor.
  • Good resistance owing to weak acid electrolytic plating.
  • Stable precipitation efficiency and excellent stability compared to the existing solution

PRECIPITATION EFFICIENCY BY THE CHANCE OF CURRENT DENSITY

전류 밀도 변화에 의한 석출효율

STABILIZATION OF T8400 PRECIPITATION EFFICIENCY

T8400 석출효율의 안정화

CHANGE OF T8400 PRECIPITATION EFFICIENCY BY TIME

T8400 석출효율의 시간에 따른 변화

PLATING UNIFORMITY

도금의 균일성

EFATURES FOR PLATING SOLUTION

Feature \ Plating solution Temperex existing product Temperex209a Temperex 8400
Precipitation Purity(%) 99.99 99.99 99.99
AuaeA(g/L) 8 4 8
pH 6.5 4.7 6.0
Specific gravity (Be′) 14~25 20~18 13~20
TEMP(℃) 65 65 65
Current density (A/dm²) 0.2~1.0 0.1~0.5 0.2~1.0
Precipitation efficiency (mg/A.min) 110~120 110~120 110~120

Tech.Data - Electrics gold Plating Process

Electrics gold Plating Process correspoding to Pb Free

Pb Free에 대응하는 무전해 금 도금 Process

Precipitaion Efficiency by the change of current density

시안 Type 치환형 무전해 도금 Electroless Au1210, 1300
  • Pb free - Ni/P PROCESS optimized PROCESS
  • Good soldering features (joint strength, Solder wetting)
  • Continuously usable for long time
  • Applicable to thin plating or thick plating

Plating Solution Features

Feature \ Plating Solution
LECTROLESS 1210 LECTROLESS AU1300
Precipitation velocity (%) 99.9+ 99.9+
Au amount (g/L) 1.5 2
Type weak acid weak acid
Humidity(℃) 75-85 75-90
Precipitation efficiency (mg/㎛.㎝) 1.90-1.93 1.90-1.93
도금액 특성

CYAN Type Alkail Electroless Gold Plating CERAGOLD 6060, 6070

시안 Type 알카리성 무전해 금 도금 CERAGOLD 6060, 6070
  • Pb free environmental PROCESS corresponding to RoHS
  • Wire Bondin capacity, heat resistance, Solder wetting capacity
  • High speed precipitation to give excellent productivity
  • Easily manageable for solution owing to the analyzing possibility of valid contents

Plating Solution Features

  Existing TI CG6060 CG6070
Morphology lemon lemon lemon
TI concentration 9ppm 2ppm 2ppm
Precipitation velocity 3~5㎛/hr. 4~6㎛/hr. 3~5㎛/hr.
TIporosity 151ppm 35ppm 35ppm
도금액 특성

Tech.Data - high speed Au/Co Plating

high speed Au/Co Plating PROCESS for Connector

Connecter용 고속 Au/Co 도금 Process
  • Corrensponding to High Speed Electroplating : Applicable to the thickness from high current density to 0.5㎛, corresponding to PtR
  • Wide Golss Extent : Soft material, achievable of the precipitation with gloss in wide range of current density, little change of morphology by the temperature, humidity, and pH, and wide application range
  • Corrosion Resistance, Joint Strength, Good Soldering : Electronics, especially suitable to Connector Application

Conditions AUTRONEX exiting one AUTRONEX GVC
Limit current density 4A/dm² 10A/dm²
Precipitation efficiency Lowering by the increase of current density
Precipitation velocity Gradually decreasing with standard for the current density of 1~3A/dm²
Purity Au 99.0% more or less Au 99.0% more or less
Hardness 130-240 120-190
Plating Film Morphology Gold color Reddish brown

RUNNING COST

RUNNING COST 설명 그래프 이미지

Precipitation speed change by the amount of Gold

금량에 의한 석출 속도 변화 그래프 이미지

Precipitation efficiency / current density

석출 속도 비
  • COMPANY
  • SITEMAP
  • INQUIRY
TechnoPark 102402, SamJakRo 22, OJeongGu, BuCheonSi, KyungGiDo, 421740, KOREA
t +82 32 327 3322 / f +82 32 327 2600 / Director : bohyun.lee, bohyun.lee@woolimworld.com / e-mail : woojoo.jang@woolimworld.com
Copyright (c) 2011 WooLimWorld Co.,Ltd. All rights reserved.