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Overview

“Excellent Conductive Material approved its Quality by ISO9001"

As it becomes developed the electronic industry, which demands mulit-function, minatruization, and light weight, it is to be required the high reliability and stability for outer enviroment. So conductive material is originally and generally used as a simple electrode to connect the material and electronic components, but it is also used in special field for component as it is.

Conductive Material : Features and Merits

  • 01Using the material with purity 99.99% or more, which giving elevation of quality
  • 02Providing technical consulting with 30-years technical know-how
  • 03Adopting quality assurance system according to ISO9001, the best of customer satisfaction

Types - Precious Metal Powder

Precious Metal Powder : Overview

사진

Precious Metal Powder is an important base material in electromagnetic field. Out of them, it is mainly used in Paste of the resource of Ceramic electronic component. Besides, it is also used in sintering and conductive rubber. It is shaped as sphere, plate, mass, and cohesive phase. Pd and Ag-Pd are used for complementing the shortage of Ag Powder. Ag Coated Cu Powder is considered when supplementing the demerit of Ag Powder and saving the prime cost.

Precious Metal Powder :Types

귀금속 Powder의 종류 사진

Types - Ag Expoxy

Ag Epoxy : Overview

사진

It works as similar with Ag Paste, but it is added polymer since this is used in attaching to circuit and forming of it, so it is cured with the temperature 300

Ag Epoxy : Types

There are following types of Die Attach LED, PCB Jumper, and PCB Through Hole.

Dimension - Precious Metal Powder

Select right box to see the detailed dimension for its type

귀금속 Powder

ITEM Standard used Purity
(wt %)
Apparent Density
Silver Powder HP0107 Contact Point ≥99.5 -
HP0111 Contact Point ≥99.5 -
Silver Flake HP0202A Membrane Switch ≥99.0 -
HP0202C MLC ≥99.0 -
HP0202E EMI Shield ≥99.0 -
HP0202LE LCD Electrode ≥99.0 -
AgCu Powder HP0410 PCB Ag 10% -
HP0420 PCB Ag 20% -
AgCu Flake HP0420M1 PCB Ag 20% -
Silver Powder HP0501 Sintering Paste ≥98.5 -
HP0510 Powder ≥99.0 -
Silver Powder HP0600 Battery ≥99.5 1.5∼1.8
HP0700 PDP ≥99.0 -
ITEM Standard Tap Density Surface Area Size
Silver Powder HP0107 1.0∼2.0 - 0.5∼2
HP0111 2.0∼3.0 - 5∼10
Silver Flake HP0202A 2.6∼3.8 0.5∼1.2 6∼12
HP0202C 3.2∼4.2 0.8∼2 3∼7
HP0202E 2.6∼4.0 1∼2 1.0∼3.5
HP0202LE 2.6∼3.8 0.5∼1.2 5∼8
AgCu Powder HP0410 3.0∼4.5 0.2∼0.7 5∼7
HP0420 3.0∼4.5 0.2∼0.7 5∼7
AgCu Flake HP0420M1 4.0∼5.5 0.2∼0.5 7∼11
Silver Powder HP0501 2.0∼2.5 - 0.05∼0.2
HP0510 1.5∼2.5 - 0.1∼0.5
Silver Powder HP0600 - - 3∼10
HP0700 4.0∼5.5 0.3∼0.7 1∼2

SILVER POWDER HP-0107

ITEM Standard Used
Weight Loss Fired at 538℃ for 30min ≤0.50%
Specific Surface Area B. E. T. Reference
Density Tap 1.0-2.0g/cc
Particle Size
Distribution
By MS2000 90% less than ≤35㎛
By MS2000 50% less than ≤20㎛
By MS2000 10% less than ≤7㎛

SILVER POWDER HP-0107 CLOSE UP

HP-0107 이미지

SILVER POWDER HP-0111

ITEM Standard Used
Weight Loss Fired at 538℃ for 30min ≤0.5%
Specific Surface Area B. E. T. Reference
Density Tap 2.0-3.0g/cc
Particle Size
Distribution
By MS2000 90% less than ≤45㎛
By MS2000 50% less than ≤25㎛
By MS2000 10% less than ≤10㎛

SILVER POWDER HP-0111 CLOSE UP

HP-0111 이미지

SILVER POWDER HP-0202A

ITEM Standard Used
Weight Loss Fired at 538℃ for 30min ≤1.00%
Specific Surface Area B. E. T. Reference
Density Tap 3.2 ± 0.6g/cc
Particle Size
Distribution
By MS2000 90% less than ≤25㎛
By MS2000 50% less than ≤12㎛
By MS2000 10% less than ≤4㎛

SILVER POWDER HP-0202A CLOSE UP

HP-0202A 이미지

SILVER POWDER HP-0202C

ITEM Standard Used
Weight Loss Fired at 538℃ for 30min ≤1.00%
Specific Surface Area B. E. T. Reference
Density Tap 3.2 - 4.2g/cc
Particle Size
Distribution
By MS2000 90% less than ≤25.0㎛
By MS2000 50% less than ≤8.0㎛
By MS2000 10% less than ≤1.5㎛

SILVER POWDER HP-0202C CLOSE UP

HP-0202C 이미지

SILVER POWDER HP-0202E

ITEM Standard Used
Weight Loss Fired at 538℃ for 30min ≤1.0 %
Specific Surface Area B. E. T. Reference
Density Tap 2.6 - 4.0g/cc
Particle Size
Distribution
By MS2000 90% less than ≤9.0㎛
By MS2000 50% less than ≤3.5㎛
By MS2000 10% less than ≤1.5㎛

SILVER POWDER HP-0202E CLOSE UP

HP-0202E 이미지

SILVER POWDER HP-0202LE

ITEM Standard Used
Weight Loss Fired at 538℃ for 30min ≤1.0 %
Specific Surface Area B. E. T. Reference
Density Tap 3.2±0.6g/cc
Particle Size
Distribution
By MS2000 90% less than ≤18㎛
By MS2000 50% less than ≤8㎛
By MS2000 10% less than ≤3㎛

SILVER POWDER HP-0202LE CLOSE UP

HP-0202LE 이미지

SILVER POWDER HP-0410

ITEM Standard Used
Ag Content Chemical Analyze 10 ± 1%
Specific Surface Area B. E. T. Reference
Density Tap 3.0 - 4.5g/cc
Particle Size
Distribution
By MS2000 90% less than ≤40㎛
By MS2000 50% less than ≤25㎛
By MS2000 10% less than ≤15㎛

SILVER POWDER HP-0410 CLOSE UP

HP-0410 이미지

SILVER POWDER HP-0420

ITEM Standard Used
Ag Content Chemical Analyze 20 ± 1%
Specific Surface Area B. E. T. Reference
Density Tap 3.0-4.5g/cc
Particle Size
Distribution
By MS2000 90% less than ≤40㎛
By MS2000 50% less than ≤25㎛
By MS2000 10% less than ≤15㎛

SILVER POWDER HP-0420 CLOSE UP

HP-0420 이미지

SILVER POWDER HP-0420M1

ITEM Standard Used
Ag Content Chemical Analyze 20 ± 1%
Specific Surface Area B. E. T. Reference
Density Tap 4.0 - 5.5g/cc
Particle Size
Distribution
By MS2000 90% less than ≤30㎛
By MS2000 50% less than ≤10㎛
By MS2000 10% less than ≤4㎛

SILVER POWDER HP-0420M1 CLOSE UP

HP-0420M1 이미지

SILVER POWDER HP-0501

ITEM Standard Used
Weight Loss Fired at 538℃ for 30min ≤1.50%
Specific Surface Area B. E. T. Reference
Density Tap 2.0 - 2.5g/cc
Particle Size
Distribution
By MS2000 90% less than ≤1.5㎛
By MS2000 50% less than ≤0.8㎛
By MS2000 10% less than ≤0.5㎛

SILVER POWDER HP-0501 CLOSE UP

HP-0501 이미지

SILVER POWDER HP-0510

ITEM Standard Used
Weight Loss Fired at 538℃ for 30min ≤1.00%
Specific Surface Area B. E. T. Reference
Density Tap 1.5 - 2.5g/cc
Particle Size
Distribution
By MS2000 90% less than ≤25㎛
By MS2000 50% less than ≤10㎛
By MS2000 10% less than ≤2.5㎛

SILVER POWDER HP-0510 CLOSE UP

HP-0510 이미지

SILVER POWDER HP-0600

ITEM Standard Used
Weight Loss Fired at 538℃ for 30min ≤0.50%
Specific Surface Area B. E. T. Reference
Density Tap 1.5 - 1.8g/cc
Particle Size
Distribution
Over #70 20%
#70 20%
#200 30%
#325 30%

SILVER POWDER HP-0600 CLOSE UP

HP-0600 이미지

SILVER POWDER HP-0700

ITEM Standard Used
Weight Loss Fired at 538℃ for 30min ≤1.00%
Specific Surface Area B. E. T. Reference
Density Tap 4.0 - 5.5g/cc
Particle Size
Distribution
By MS2000 90% less than ≤4.0㎛
By MS2000 50% less than ≤2.0㎛
By MS2000 10% less than ≤1.0㎛

SILVER POWDER HP-0700 CLOSE UP

HP-0700 이미지

Dimension - Ag Expoxy

Select right box to see the detailed dimension for its type

Ag Expoxy

APPLICATION
PRODUCT
SERIES
NO.
FILLER
(wt%)
DRYING
TEMP.
VISCOSITY
(KCPS)
COATING
METHOD
Die Attach L.E.D HP 1000 68~72 175~230℃
(30~60min)
Accede to
Customer’s
Demand
Brook Field
Model LVT
Dispensing
PCB Jumper HPJP 65~75 80/160℃ Printing
PCB Through Hole HPTH 55~65 80/160℃ Printing

SILVER EXPOXY HP-1000

Properties Measurement Data
Viscocity BROOKFIELD Viscometer 16,000±5,000cps
Specific Resistance M Ω Meter 5.0 X 10-⁴Ωcm이하
Die Shear Strenght Shear Gauge 2kgf이상
Ionlmpurity Ion Chromatography ≤20ppm
AAS ≤10ppm
Solid Content Hot Wind Dryer 90 ± 5 %
Ag Content Electric Fumace 70 ± 2 %

SILVER EPOXY HP-1000 CLOSE UP

HP-1000 이미지

Processing - Precious Metal Powder

Precious Metal POWDER : Processing

귀금속 POWDER의 제품공정 그림

Processing - Ag Expoxy

Ag Expoxy : Processing

Ag Expoxy의 제품공정 그림

Tech.Data

Comparison of Precious Metal Powder With other companies' Spec.

* This is our product table comparable to the advanced company F.

SPEC Company F
#15
HP
0202
LE
Company F
#9H
HP
0202
E
Company F
#70A
HP
0202
E
Company T
SF-241
HP
0202
E
Company F
#D40
HP
0202
C
TAP Density 3.0-3.9 2.6-3.8 2.8-3.5 2.6-4.0 2.6-3.8 2.6-4.0 3.7 2.6-4.0 3.4-3.9 3.2-4.2
BET 0.6-1.2 Ref. 0.7-1.3 Ref. 1.15-1.75 Ref. 0.8 Ref. 1.2-1.8 Ref.
PSD D90 13㎛ 18 ㎛ 9.5㎛ 9.0 ㎛ 8.5 ㎛ 9.0 ㎛ 2.9 ㎛ 9.0 ㎛ 10-16㎛ 25 ㎛
D50 5.5㎛ 8 ㎛ 3.5㎛ 3.5 ㎛ 3.0㎛ 3.5 ㎛ 1.5 ㎛ 3.5 ㎛ 3.5-8㎛ 8 ㎛
D10 1.5 ㎛ 3 ㎛ 1.5 ㎛ 1.5 ㎛ 1.5 ㎛ 1.5 ㎛ 0.3 ㎛ 1.5 ㎛ 1-3㎛ 1.5 ㎛
Wt. Loss ≤ 0.6% ≤ 1.0% ≤ 0.6% ≤ 1.0% ≤ 0.25% ≤ 1.0% ≤ 0.62% ≤ 1.0% ≤ 0.8% ≤ 1.0%
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